Literature: Thermoelectric materials and devices
INTENSIFICATION OF HEAT TRANSFER FROM THE IC CHIP TO THE HEAT SINK THROUGH THE USE OF NANOFILM THERMOELECTRIC HEAT PUMP
Metadata from OpenAlex, exported on 9 September 2026. It is the provider's report, not verified here.
What the provider reports
- Authors
- Т. А. Исмаилов, H. M. Gadjiyev, T. A. Chelushkinа, D. A. Chelushkin
- Published
- 1 January 2014
- Venue
- Herald of Dagestan State Technical University Technical Sciences
- DOI
- 10.21822/2073-6185-2014-32-1-7-15
- OpenAlex id
- W2796703355
- Primary topic, as reported
- Advanced Thermoelectric Materials and Devices (T10440)
- Access, as reported
- Open access: diamond; licence cc-by. Reported access is not verified reuse permission.
- Retraction, as reported
- Not reported retracted
- Landing page
- https://doi.org/10.21822/2073-6185-2014-32-1-7-15
- PDF link, as reported
- https://vestnik.dgtu.ru/jour/article/download/255/257 (a link the provider reported, not an acquired source)
- In this collection because
- it matched the collection rule at export
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No released record is served for 10.21822/2073-6185-2014-32-1-7-15. That is the absence of a record here, not a statement about the publication. 3 catalog entries are not served by this deployment, so this may be incomplete.