Literature: Thermoelectric materials and devices
Thermal conductivity in Bi 0.5 Sb 1.5 Te 3+ x and the role of dense dislocation arrays at grain boundaries
Metadata from OpenAlex, exported on 9 September 2026. It is the provider's report, not verified here.
What the provider reports
- Authors
- Rigui Deng, Xianli Su, Zheng Zheng, Wei Liu, Yonggao Yan, Qingjie Zhang, Vinayak P. Dravid, Ctirad Uher, Mercouri G. Kanatzidis, Xinfeng Tang
- Published
- 1 June 2018
- Venue
- Science Advances
- DOI
- 10.1126/sciadv.aar5606
- OpenAlex id
- W2805531970
- Primary topic, as reported
- Advanced Thermoelectric Materials and Devices (T10440)
- Access, as reported
- Open access: gold; licence cc-by-nc. Reported access is not verified reuse permission.
- Retraction, as reported
- Not reported retracted
- Landing page
- https://doi.org/10.1126/sciadv.aar5606
- PDF link, as reported
- None served
- In this collection because
- it matched the collection rule at export
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MATTER records for this DOI
No released record is served for 10.1126/sciadv.aar5606. That is the absence of a record here, not a statement about the publication. 3 catalog entries are not served by this deployment, so this may be incomplete.