Literature: Thermoelectric materials and devices

Incorporation of copper in LaCoO3: modulating thermoelectric power factor for low- and mid-temperature thermoelectric applications

Metadata from OpenAlex, exported on 9 September 2026. It is the provider's report, not verified here.

What the provider reports

Authors
U. Deepika Shanubhogue, Ashok Rao, Bodhoday Mukherjee, Gunadhor Singh Okram, Nithya Davis, Anuradha M. Ashok, P. Poornesh
Published
1 September 2023
Venue
Journal of Materials Science Materials in Electronics
DOI
10.1007/s10854-023-11339-0
OpenAlex id
W4387165191
Primary topic, as reported
Advanced Thermoelectric Materials and Devices (T10440)
Access, as reported
Open access: hybrid; licence cc-by. Reported access is not verified reuse permission.
Retraction, as reported
Not reported retracted
Landing page
https://doi.org/10.1007/s10854-023-11339-0
PDF link, as reported
https://link.springer.com/content/pdf/10.1007/s10854-023-11339-0.pdf (a link the provider reported, not an acquired source)
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